5G Technology World

  • 5G Technology and Engineering
  • FAQs
  • Apps
  • Devices
  • IoT
  • RF
  • Radar
  • Wireless Design
  • Learn
    • 5G Videos
    • Ebooks
    • EE Training Days
    • FAQs
    • Learning Center
    • Tech Toolboxes
    • Webinars/Digital Events
  • Handbooks
    • 2024
    • 2023
    • 2022
    • 2021
  • Resources
    • Design Guide Library
    • EE World Digital Issues
    • Engineering Diversity & Inclusion
    • Engineering Training Days
    • LEAP Awards
  • Advertise
  • Subscribe

12mm Elastomer Designed For High Performance Tasks

By Ironwood Electronics | June 12, 2017

Ironwood Electronics has introduced a high performance elastomer socket for 0.4mm pitch BGA package. The SG25-BGA-2032 socket is designed for a 12mmx12mm package size and operates at bandwidths up to 65 GHz with less than 1dB of insertion loss (GSSG configuration). The contact resistance is typically 20 milliohms per pin. Network analyzer reflection measurements for the G-S-S-G case were taken with all except the pins under consideration terminated into 50 Ohms.

The socket is mounted using supplied hardware on the target PCB with no soldering, and uses smallest footprint in the industry. The smallest footprint allows inductors, resistors and decoupling capacitors to be placed very close to the device for impedance tuning. The socket also incorporates a simple swivel hardware installation method so that IC’s can be changed out quickly.

The SG25-BGA-2032 sockets are constructed with high performance and low inductance elastomer contactor. The temperature range is -35C to +100 C. The pin self inductance is 0.06 nH and mutual inductance of 0.019 nH. Capacitance to ground is 0.129 pF and mutual capacitance is 0.017pF. Current capacity is 2 amps per pin.


Filed Under: RF

 

Next Article

← Previous Article
Next Article →

Related Articles Read More >

Open RAN test service adds colocation capabilities
Switch operates DC to 20 GHz with 128 configurable connection states for asymmetric SerDes testing
Butler Matrix
Butler Matrix drives Wi-Fi and other phased-array antennas
Long-wire dipole antennas: still viable after more than a century

Featured Contributions

  • Overcome Open RAN test and certification challenges
  • Wireless engineers need AI to build networks
  • Why AI chips need PCIe 7.0 IP interconnects
  • circuit board timing How timing and synchronization improve 5G spectrum efficiency
  • Wi-Fi 7 and 5G for FWA need testing
More Featured Contributions

EE TECH TOOLBOX

“ee
Tech Toolbox: 5G Technology
This Tech Toolbox covers the basics of 5G technology plus a story about how engineers designed and built a prototype DSL router mostly from old cellphone parts. Download this first 5G/wired/wireless communications Tech Toolbox to learn more!

EE LEARNING CENTER

EE Learning Center
“5g
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.

Engineering Training Days

engineering
“bills
5G Technology World
  • Enews Signup
  • EE World Online
  • DesignFast
  • EDABoard Forums
  • Electro-Tech-Online Forums
  • Microcontroller Tips
  • Analogic Tips
  • Connector Tips
  • Engineer’s Garage
  • EV Engineering
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips
  • About Us
  • Contact Us
  • Advertise

Copyright © 2025 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy

Search 5G Technology World