5G Technology World

  • 5G Technology and Engineering
  • FAQs
  • Apps
  • Devices
  • IoT
  • RF
  • Radar
  • Wireless Design
  • Learn
    • 5G Videos
    • Ebooks
    • EE Training Days
    • FAQs
    • Learning Center
    • Tech Toolboxes
    • Webinars/Digital Events
  • Handbooks
    • 2024
    • 2023
    • 2022
    • 2021
  • Resources
    • Design Guide Library
    • EE World Digital Issues
    • Engineering Diversity & Inclusion
    • Engineering Training Days
    • LEAP Awards
  • Advertise
  • Subscribe

ASU Engineer is Pulling CO2 Out of Thin Air

By Arizona State University | April 22, 2015

It’s the massive buildup of carbon dioxide (CO2) in the atmosphere that makes it increasingly likely we will see warming temperatures, longer droughts and rising sea levels – all posing challenges to the habitability of much of the planet.

At the Center for Negative Carbon Emissions at Arizona State University, director Klaus Lackner is developing a method to remove CO2 from the air with a resin material that absorbs the gas.

Lackner is a physicist and professor in the School of Sustainable Engineering and the Built Environment, one of ASU’s Ira A. Fulton Schools of Engineering.

The plastic resin he is working with shows promise as the linchpin of a process to capture large amounts of atmospheric CO2 for reuse and permanent disposal.

Along with developing the technology, another key effort of Lackner’s center is to convince people of the economic feasibility of the process and to pave the way for its commercialization on a major industrial scale.

In an extensive article, Fast Company magazine reports on Lackner’s outlook on the possibility of building up the enterprise to a level at which it could have a global impact.

Related Articles Read More >

FAQ on the Butler matrix for beamforming: part 2
10 GHz RF cables feature double shields
Test wireless signal to 110 GHz with this 1-mm cable
Wireless modules enhance IoT devices through theft-prevention tracking

Featured Contributions

  • Overcome Open RAN test and certification challenges
  • Wireless engineers need AI to build networks
  • Why AI chips need PCIe 7.0 IP interconnects
  • circuit board timing How timing and synchronization improve 5G spectrum efficiency
  • Wi-Fi 7 and 5G for FWA need testing
More Featured Contributions

EE TECH TOOLBOX

“ee
Tech Toolbox: Internet of Things
Explore practical strategies for minimizing attack surfaces, managing memory efficiently, and securing firmware. Download now to ensure your IoT implementations remain secure, efficient, and future-ready.

EE LEARNING CENTER

EE Learning Center
“5g
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.

Engineering Training Days

engineering
“bills
5G Technology World
  • Enews Signup
  • EE World Online
  • DesignFast
  • EDABoard Forums
  • Electro-Tech-Online Forums
  • Microcontroller Tips
  • Analogic Tips
  • Connector Tips
  • Engineer’s Garage
  • EV Engineering
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips
  • About Us
  • Contact Us
  • Advertise

Copyright © 2025 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy

Search 5G Technology World