San Francisco — At last year’s OFC 2024, the next speed of optical connections (1.6T) was all talk with one exception. In a back room, Keysight demonstrated a 1.6T optical link between an arbitrary waveform generator and a bit-error-rate tester. The demonstration was a transmission of raw, unstructured bits. One thing was clear, AI was…
DSL router uses parts from old phones
A consortium of companies found a clever way to recycle phone parts, showing how reusing electronics can improve sustainability. Electronic waste is a huge environmental problem of which disposed cell phones are a major contributor. Think about it, all that metal, plastic, and working semiconductors go into landfills. Some materials, such as gold from PCB…
Wi-Fi HaLow SoC transfers data at 43.3 Mbps
Morse Micro has announced the launch of its second-generation MM8108 System-on-Chip (SoC). Building on the first-generation MM6108 SoC, the MM8108 offers additional performance in all key areas of range, throughput, and power efficiency while reducing the cost, effort, and time to bring the next generation of Wi-Fi HaLow-enabled products to market. The SoC for sub-GHz…
IoT wireless module receives approval from two US cellular carriers
Telit Cinterion receives approval for the ME310M1-W1 module from two major U.S. MNOs. The certifications enable IoT specialists and their customers to begin using the ME310M1-W1 immediately — not only in the United States but also worldwide — thanks to its comprehensive global band support. With the support of multiple technologies, including licensed and unlicensed…
12 nm silicon IP integrates multi-standard connectivity
Ceva, Inc. unveiled the Ceva-Waves Links200, the first turnkey multi-protocol platform IP to support next-generation Bluetooth High Data Throughput (HDT) technology, alongside IEEE 802.15.4 for Zigbee, Thread, and Matter. Integrating a new Ceva-developed radio designed for TSMC’s low-power 12nm process, the comprehensive Links200 solution provides a significant time-to-market advantage by removing technology barriers and risk…
Why AI chips need PCIe 7.0 IP interconnects
Today’s SoC designers need to design PCIe 7.0 into new AI chip designs. First-pass silicon success is critical to meet the increasing performance and bandwidth demands of data-intensive applications. Data center technologies need to evolve to enable AI’s increasing workload and demands, especially as the number of parameters doubles every four to six months —…
Dual-mode IoT module combines cellular and wM-Bus communication
The ST87M01 cellular data-communications module integrates NB-IoT certification and an optional ST4SIM embedded SIM. The module features dual communication capabilities through NB-IoT cellular connectivity and wireless Meter-Bus (wM-Bus), providing redundant data transmission channels for applications like utility consumption monitoring. A software-defined radio enables dynamic switching between NB-IoT and sub-GHz wM-Bus modes. The module supports direct…
IEEE Phased Array 2024: what we saw
The IEEE Phased Array conference occurred in Boston on October 15-17, 2024. This specialized conference had a small exhibit floor. Here is some of what was on display. Boston — The 2024 IEEE International Symposium on Phased Array Systems & Technology moved into the city after taking place in a suburban Boston hotel for several…
How timing and synchronization improve 5G spectrum efficiency
5G moved from FDD to TDD to improve spectrum efficiency. That move resulted in new timing issues to keep networks in sync.
Cellular LTE module snags AT&T network approval
The Telit Cinterion ME310M1-W1 LTE module received approval for use on the AT&T network, adding cellular connectivity to IoT devices.