TRUMPF Photonic Components has introduced a 100G VCSEL for data communication applications, demonstrating the device at the European Conference on Optical Communication in Copenhagen from September 29th to October 1st. The 850nm multimode datacom VCSEL provides bandwidth and linearity performance at temperatures up to 85°C for use in 800G SR8 and 400G SR4 active optical…
6G needs less, 6G needs more
From radios to core networks, a consensus is forming that 6G needs to offer more focused technology than 5G, or is it more technology? Energy, spectrum, and AI top the list of what 6G needs. EE World spoke with four engineers who attended the March 3GPP meeting in Korea. Here’s what they had to say.…
IEEE Phased Array 2024: what we saw
The IEEE Phased Array conference occurred in Boston on October 15-17, 2024. This specialized conference had a small exhibit floor. Here is some of what was on display. Boston — The 2024 IEEE International Symposium on Phased Array Systems & Technology moved into the city after taking place in a suburban Boston hotel for several…
IMS 2024 roundup: RF components
Washington, DC — The International Microwave Symposium (IMS), which took place here in June 2024, featured a wide array of RF, microwave, and mmWave components. These components range from passive connectors and waveguides to amplifiers, switches, filters, and data converters. In general, these components make their way into military communications systems or commercial wireless networks.…
Specification package helps engineers design Z-Wave home-automation products
The Z-Wave Alliance announces the release of the 2024A Z-Wave Specification Package, which includes new User Credential Command Class features, as well as new User Credential Control Specifications. The Alliance has also published a new Z-Wave Reference Application Design (ZRAD), a publicly available repository of data including detailed schematics and reference designs to help developers create Z-Wave…
Our 2024 Communications Handbook is here
EE World announces its 2024 5G, Wireless, & Wireline Communications Handbook in digital form. It’s that time again. EE World’s 2024 5G, Wireless, & Wireline Communications Handbook is here. The 41-page e-book contains ten technical articles plus an editorial. This year, we cover: Network timing, mmWaves (two articles), Power amplifiers (three articles), test & measurement…
Front-end mmWave IC combines PA, LNA, and switch
mmTron announced its first single-chip front-end IC for mmWave communications. Covering 24 to 30 GHz, the TMC252 integrates a power amplifier (PA), low noise amplifier (LNA), and transmit-receive switch on a single GaN IC that is available as a die or packaged in a 5 mm x 5 mm air-cavity QFN. The TMC252 is well-suited…
6G conference exhibits demonstrate possible technologies
At the 6G Symposium and 6G Summit, attendees saw the latest research that could lead to the next generation of wireless.
6G Symposium: The discussions continue
The 6G Symposium took place on October 18 and 19, 2023, in Washington, DC. This year, the talk was more about use cases, with less talk about sustainability than in the past. One week before the symposium, I heard two contrasting views on 5G given at a virtual conference. In the morning, Chris Pearson of…
IMS 2023 roundup: semiconductors and microwave components
Through photos and videos, EE World covers some of the active and passive components that RF and wireless engineers need to connect us all.