Morse Micro has announced the launch of its second-generation MM8108 System-on-Chip (SoC). Building on the first-generation MM6108 SoC, the MM8108 offers additional performance in all key areas of range, throughput, and power efficiency while reducing the cost, effort, and time to bring the next generation of Wi-Fi HaLow-enabled products to market. The SoC for sub-GHz…
12 nm silicon IP integrates multi-standard connectivity
Ceva, Inc. unveiled the Ceva-Waves Links200, the first turnkey multi-protocol platform IP to support next-generation Bluetooth High Data Throughput (HDT) technology, alongside IEEE 802.15.4 for Zigbee, Thread, and Matter. Integrating a new Ceva-developed radio designed for TSMC’s low-power 12nm process, the comprehensive Links200 solution provides a significant time-to-market advantage by removing technology barriers and risk…
Why AI chips need PCIe 7.0 IP interconnects
Today’s SoC designers need to design PCIe 7.0 into new AI chip designs. First-pass silicon success is critical to meet the increasing performance and bandwidth demands of data-intensive applications. Data center technologies need to evolve to enable AI’s increasing workload and demands, especially as the number of parameters doubles every four to six months —…
Two Bluetooth modules bring high-end MCU, low power to IoT devices
u-blox has announced two additions to its Bluetooth LE portfolio, ALMA-B1 and NORA-B2. The modules are based on the latest generation nRF54 Series Systems-on-Chip (SoCs) from Nordic Semiconductor. They both support Bluetooth LE 5.4 and Thread/Matter technologies in a compact, power-efficient, and secure format. ALMA-B1 and NORA-B2 are designed for a wide range of IoT applications, including…
Cellular SoC includes RF amp, power management, GNSS, NB-IoT, and DECT NR+
Nordic Semiconductor announces the expansion of its nRF91 Series cellular IoT devices with the introduction of the nRF9151 System-in-Package (SiP). The nRF9151 further enhances Nordic’s end-to-end cellular IoT solution, which encompasses hardware, software, tools, and nRF Cloud Services, providing advanced capabilities and seamless integration to significantly simplify the development process. The nRF9151 offers a compact,…
Active baluns bridge the microwave and digital worlds
To achieve the datasheet performance of ultra-high-speed data converters, now clocking to 64 GS/sec, the handoff to and from the microwave domain must be near perfect. To preserve the data converters’ spurious-free dynamic range, a new category of component has been developed that converts between the differential and single-ended signal domains while amplifying and filtering out-of-band signals.
Crystals for mmWave SoCs feature thermistors
Kyocera has begun mass production of products certified by IC manufacturers and suitable for smartphones compatible with 5G millimeter-wave ultra-high-speed communications, which will be increasingly in demand. Low ESR and stable temperature characteristics are achieved using Kyocera’s outstanding photolithography and plasma CVM technology developed in collaboration with Osaka University (see details here). Available in 76.8MHz, Qualcomm Technologies’ Chipset…
SoC ecosystem combines data converters with DSP
The Apollo MxFE software-defined signal processing SoC from Analog Devices digitizes and generates analog signals with DSP in between. Applications cover aerospace & defense, instrumentation, and wireless communications.
5G NR chipset platform targets wireless broadband IoT
The Taurus product portfolio from Sequans Communications includes chipsets for chip-on-board designs, carrier-certified modules in various form factors, and module reference designs for customized modules. Much of the talk over wireless 5G for IoT being about low data rates. Not every application, however, can benefit from that. Some applications need higher data throughput. The Taurus…
LoRaWAN modules connect IoT devices to 15 km
The RM126x series from Laird Connectivity integrate a processor and radio that connect IoT devices for data transfer.