5G Technology World

  • 5G Technology and Engineering
  • FAQs
  • Apps
  • Devices
  • IoT
  • RF
  • Radar
  • Wireless Design
  • Learn
    • 5G Videos
    • Ebooks
    • EE Training Days
    • FAQs
    • Learning Center
    • Tech Toolboxes
    • Webinars/Digital Events
  • Handbooks
    • 2024
    • 2023
    • 2022
    • 2021
  • Resources
    • Design Guide Library
    • EE World Digital Issues
    • Engineering Diversity & Inclusion
    • Engineering Training Days
    • LEAP Awards
  • Advertise
  • Subscribe

5G SoCs target premium, flagship smartphones

By Aimee Kalnoskas | November 27, 2019

dimensity 5G SoCThe new MediaTek Dimensity 5G chipset family is the first 5G mobile SoC in its 5G family of chipsets and features an integrated 5G modem, The first Dimensity powered devices will start hitting the market in Q1 of 2020. The device also supports 5G two carrier aggregation (2CC CA) and boasts a throughput of 4.7Gbps downlink and 2.5Gbps uplink speeds over sub-6GHz networks. The chipset is designed to support stand alone and non-stand alone (SA/NSA) sub-6GHz networks, and includes multi-mode support for every cellular connectivity generation from 2G to 5G.

It also integrates the latest Wi-Fi 6 and Bluetooth 5.1+ standards for the fastest and most efficient local wireless connectivity, offering more than 1Gbps throughput in both downlink and uplink speeds.

Dimensity 1000 pairs four Arm Cortex-A77 cores operating up to 2.6GHz with four power-efficient Arm Cortex-A55 cores operating at up to 2.0GHz. This design enables an optimal balance of high performance and power-efficiency. The chipset is also the world’s first to pack Arm Mali-G77 GPU to enable seamless streaming and gaming at 5G speeds.

The SoC includes a new MediaTek AI Processing Unit – APU 3.0 – with more than double the performance of the previous generation APU. It brings devices a significant performance boost at 4.5 TOPS.

Key features:

  • With the world’s first dual 5G SIM technology, in addition to support for services such as Voice over New Radio (VoNR), the 5G SoC delivers seamless connectivity across networks and offers consistent speeds.
  • The chipset’s integrated 5G modem delivers extreme energy efficiency and is a more power efficient design than competing solutions. This compact, integrated design also lets brands use the extra space for other features like a bigger battery or larger camera sensors.
  • With 5G carrier aggregation, the chipset posts higher average speeds and performs a seamless handover between two connection areas (high speed layer and coverage layer) for seamless high speed connections when users are on the go.
  • With the world’s first five-core image signal processor (ISP) combined with MediaTek’s Imagiq+ technology, Dimensity 1000 provides a truly extraordinary camera and video experience. The chipset supports 80MP cameras sensors at 24 frames per second and a range of multi-camera options such as 32+16MP dual cameras.
  • The APU supports advanced AI-camera enhancements for autofocus, auto exposure, auto white balance, noise reduction, high-dynamic-range (HDR) and facial detection, along with the world’s first multi-frame video HDR capability.
  •  The chipset delivers stunning graphics with support for Full HD+ displays up to 120Hz and 2K+ up to 90Hz. Dimensity 1000 is the first mobile SoC to support Google AV1 format up to 4K resolution at 60fps, elevating the video streaming experience to new levels.

Dimensity 1000 is designed for global sub-6GHz 5G networks that are launching in Asia, North America and Europe.


Filed Under: 5G, ICs, mm Wave
Tagged With: mediatek
 

Next Article

← Previous Article
Next Article →

Related Articles Read More >

2.4 GHz chip antennas connect IoT devices to networks
6G
6G needs less, 6G needs more
Demonstration shows 5G handset communicating through satellites
RemCom Wireless InSite 4.0
Software simulates RF conditions from the Earth to the Moon

Featured Contributions

  • Overcome Open RAN test and certification challenges
  • Wireless engineers need AI to build networks
  • Why AI chips need PCIe 7.0 IP interconnects
  • circuit board timing How timing and synchronization improve 5G spectrum efficiency
  • Wi-Fi 7 and 5G for FWA need testing
More Featured Contributions

EE TECH TOOLBOX

“ee
Tech Toolbox: Internet of Things
Explore practical strategies for minimizing attack surfaces, managing memory efficiently, and securing firmware. Download now to ensure your IoT implementations remain secure, efficient, and future-ready.

EE LEARNING CENTER

EE Learning Center
“5g
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.

Engineering Training Days

engineering
“bills
5G Technology World
  • Enews Signup
  • EE World Online
  • DesignFast
  • EDABoard Forums
  • Electro-Tech-Online Forums
  • Microcontroller Tips
  • Analogic Tips
  • Connector Tips
  • Engineer’s Garage
  • EV Engineering
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips
  • About Us
  • Contact Us
  • Advertise

Copyright © 2025 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy

Search 5G Technology World