Deutsche Telekom (DT) Tuesday filed with the SEC its intention to offer $3.1 billion in T-Mobile USA bonds. 

The company will offer two series of $1.25 billion each and one of $600 million to make the total amount. 

The first round of $1.25 billion in senior notes at 6.464 percent will be due in 2019. The second round of $1.25 billion in senior notes at 6.633 percent will be due in 2021, and the $600 million of 6.836 percent senior notes will come due in 2023. 

DT said the proceeds will be used to serve the company’s “general corporate purposes.”

The notes are part DT’s acquisition of MetroPCS, which the company is in the process of integrating into T-Mobile USA. 

Shares of the company were down 1.24 percent Tuesday to €11.19.