SINGAPORE (September 19, 2013) — FCI will be exhibiting its latest range of automation connector solutions at Automation 2013, Asia’s leading automation event. Automation 2013 provides a platform for the best minds and leading solution providers in the industry, including FCI, to interact and drive innovations within the automation sphere.
As automation is ubiquitous across a wide spectrum of sectors, including industrial processes, instrumentation, logistics, control systems and robotics, FCI is similarly featuring a comprehensive suite of high performance connectors so that engineers will be able to find optimal solutions for any applications. Prominent product categories that FCI will be featuring at the exhibition include backplane connectors, power distribution solutions, input/output connectors, terminal blocks, board/board-wire-to-broad connectors, cable assemblies and flex circuit connectors.
One of the products that FCI will be showcasing at Automation 2013 is the Minitek 127, an extensive modular range of connectors for all types of wire-to-board and cable-to-board automation applications. This family of connectors includes straight and right angle, surface mount and through mount, complete with different plating variations from 6 up to 80 positions. These connectors can also withstand extreme temperature from -55°C to +125°C, allowing the components to operate in adverse conditions.
This versatile connector series is one of the most fully configurable systems available in the market and engineers can tailor it for different designs. Minitek 127 is also highly interoperable and is inter-mateable with other common designs, which address many compatibility challenges in complex automation systems. This highly durable product can also support up to 100 mating cycles, which helps to extend the lifespan of the automation equipment.
FCI’s HPCE cable assemblies are another category of solutions that will be highlighted at Automation 2013. These leading power solutions come in either a one-piece cable-to-card edge or a two-piece cable-to-header form. These power cables are designed to be highly flexible as they can carry high, mid and low power (from 5A to 40A per cable) as well as transmit signals. This gives design engineers the freedom to utilize these power solutions across the different segments within the automation sector.
The HPCE cables also incorporate innovative power contacts and housing designs that permit more compact and lower profile packages. Their low profile height of 7.5mm maximizes airflow and heat dissipation, which significantly increases linear current density and low contact resistance characteristics. This enables engineers to utilize FCI’s HPCE cable assemblies to meet the most demanding requirements in the next generation of automation applications.
“Automation 2013 provides a melting pot for ideas and designs from leading players within the automation ecosystem and this platform is essential to drive the evolution of automation applications,” Laurent Petit, Vice President & General Manager of FCI Asean, Japan and India. “We believe that FCI’s cutting edge products and industry experience will help crystalize these ideas into innovative automation solutions that can achieve unprecedented efficiency and productivity.”
The Automation 2013 will be held at the Bombay Exhibition Centre, from September 23 -26. Visitors will be able to catch FCI’s proven interconnect solutions for the automation industry, as well as discover their products’ features and benefits at Booth B14A.
For more information, visit http://events.fci.com/automationindia.