5G Technology World

  • 5G Technology and Engineering
  • FAQs
  • Apps
  • Devices
  • IoT
  • RF
  • Radar
  • Wireless Design
  • Learn
    • 5G Videos
    • Ebooks
    • EE Training Days
    • FAQs
    • Learning Center
    • Tech Toolboxes
    • Webinars/Digital Events
  • Handbooks
    • 2024
    • 2023
    • 2022
    • 2021
  • Resources
    • Design Guide Library
    • EE World Digital Issues
    • Engineering Diversity & Inclusion
    • Engineering Training Days
    • LEAP Awards
  • Advertise
  • Subscribe

GaN factory focuses on 5G

By Martin Rowe | November 9, 2020

NXP’s Chandler, Ariz. fab produces GaN devices used in power amplifiers across 5G frequencies, from low-band to mmWave. In this video 5G Technology Word spoke with NXP’s Paul Hart.

5G base stations need to transmit low-band, mid-band, and mmWave signals to user devices. As frequencies increase, so does the power needed to transmit over useful distances. Because of it’s high-frequency characteristics, gallium nitride (GaN), offers advantages over other processes for use in 5G base station power amplifiers. In September 2020, NXP Semiconductors opened a new fab dedicated to producing GaN transistors for 5G power amplifiers. In the video, 5G Technology World spoke with Paul Hart, executive vice president and GM of NXP’s Radio Power Group about the new Arizona fab and what GaN offers in terms of performance and efficiency.

GaN wafer from NXP Semiconductors

Figure 1. The first GaN wafer produced at NXP’s fab in Chandler, Arizona.

At the Arizona fab, NXP manufactures GaN devices specifically for the 5G power amplifier market as opposed to applications such as power conversion. Hart said that GaN devices, while more difficult to manufacture and more expensive than silicon-based devices, outperform laterally diffused MOS(LDMOS). Part of the difficulty in manufacturing comes from the fact that a GaN device sits on top of a silicon carbide (SiC) substrate, which Hart said the two don’t want to be on the same lattice. “SiC is close to diamond,” said Hart. “It’s an excellent conductor of heat.” That’s important because heat is one place where 5G needs better efficiency. Hart explained that GaN is, therefore, used only where needed within the device. In other places, you might find LDMOS and SiGe. Figure 1 shows a GaN wafer produced at the NXP fab.

Because many PAs used in 5G will have to drive as many as 64 antenna elements with power ranging from 5 W to 60 W or 80 W, packaged devices need cooling. That’s why the packaged devices have copper to the bottom of the device. Designers will then need to pull heat away using copper coins or dense via arrays. Hart noted that power efficiency in GaN devices has increased from 38% to 52% in just two years, with 60% efficiency in sight. The greater efficiency means that PAs can shrink in size and weight, making them easier and less expensive to install and operate. That could make a difference on 5G private networks installed in factories and other facilities.

Tell Us What You Think! Cancel reply

Related Articles Read More >

RemCom Wireless InSite 4.0
Software simulates RF conditions from the Earth to the Moon
Improved VNAs cover 5G FR1, Wi-Fi, and Bluetooth bands
How 5G network slicing works: part 2
Overcome Open RAN test and certification challenges

Featured Contributions

  • Overcome Open RAN test and certification challenges
  • Wireless engineers need AI to build networks
  • Why AI chips need PCIe 7.0 IP interconnects
  • circuit board timing How timing and synchronization improve 5G spectrum efficiency
  • Wi-Fi 7 and 5G for FWA need testing
More Featured Contributions

EE TECH TOOLBOX

“ee
Tech Toolbox: Internet of Things
Explore practical strategies for minimizing attack surfaces, managing memory efficiently, and securing firmware. Download now to ensure your IoT implementations remain secure, efficient, and future-ready.

EE LEARNING CENTER

EE Learning Center
“5g
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.

Engineering Training Days

engineering
“bills
5G Technology World
  • Enews Signup
  • EE World Online
  • DesignFast
  • EDABoard Forums
  • Electro-Tech-Online Forums
  • Microcontroller Tips
  • Analogic Tips
  • Connector Tips
  • Engineer’s Garage
  • EV Engineering
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips
  • About Us
  • Contact Us
  • Advertise

Copyright © 2025 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy

Search 5G Technology World