More news from Infineon Technologies this week, the chipmaker announced the availability of its new 3G platform family, which the company says is the industry’s smallest printed circuit board footprint with a space reduction of up to 40% and a standby power reduction of up to 30% compared with existing HSDPA platforms. The solutions are based on new members of the X-GOLD 61x-series and Infineon’s 3G Radio Frequency transceiver device, the SMARTi UE.
“Our new platforms enable our customers to fully reuse their hardware and software developments and launch multiple phones covering all feature phone market segments with lower cost and faster time-to-market,” said Hermann Eul, executive vice president of the Infineon Management Board and president of the Communication Solutions Business Group, in a statement.
The platform XMM 6180 with the X-GOLD 618 baseband offers HSDPA/HSUPA capabilities of 7.2Mbps/2.9Mbps, an integrated high-end video accelerator for recording and playback of VGA video content and the ability to connect to cameras with up to 5 megapixels.
The 3G feature phone platform XMM 6170 with the X-GOLD 617 baseband supports HSDPA 3.6Mbps, recording and playback functionality of QVGA video content and the ability to connect to cameras with 2 megapixels.
The modem platform solution XMM 6160 with the X-GOLD 616 baseband offers HSDPA/HSUPA capabilities of 7.2Mbps/5.8 Mbps and includes hardware and software interfaces to an application processor or a PC as wireless modem.
The company said samples and evaluation boards will be available by end of June, with volume production beginning in the second half of 2009.
