5G Technology World

  • 5G Technology and Engineering
  • FAQs
  • Apps
  • Devices
  • IoT
  • RF
  • Radar
  • Wireless Design
  • Learn
    • 5G Videos
    • Ebooks
    • EE Training Days
    • FAQs
    • Learning Center
    • Tech Toolboxes
    • Webinars/Digital Events
  • Handbooks
    • 2024
    • 2023
    • 2022
    • 2021
  • Resources
    • Design Guide Library
    • EE World Digital Issues
    • Engineering Diversity & Inclusion
    • Engineering Training Days
    • LEAP Awards
  • Advertise
  • Subscribe

Infineon Announces New 3G Platforms

By Staff Author | May 30, 2008

More news from Infineon Technologies this week, the chipmaker announced the availability of its new 3G platform family, which the company says is the industry’s smallest printed circuit board footprint with a space reduction of up to 40% and a standby power reduction of up to 30% compared with existing HSDPA platforms. The solutions are based on new members of the X-GOLD 61x-series and Infineon’s 3G Radio Frequency transceiver device, the SMARTi UE.

“Our new platforms enable our customers to fully reuse their hardware and software developments and launch multiple phones covering all feature phone market segments with lower cost and faster time-to-market,” said Hermann Eul, executive vice president of the Infineon Management Board and president of the Communication Solutions Business Group, in a statement.

The platform XMM 6180 with the X-GOLD 618 baseband offers HSDPA/HSUPA capabilities of 7.2Mbps/2.9Mbps, an integrated high-end video accelerator for recording and playback of VGA video content and the ability to connect to cameras with up to 5 megapixels.

The 3G feature phone platform XMM 6170 with the X-GOLD 617 baseband supports HSDPA 3.6Mbps, recording and playback functionality of QVGA video content and the ability to connect to cameras with 2 megapixels.

The modem platform solution XMM 6160 with the X-GOLD 616 baseband offers HSDPA/HSUPA capabilities of 7.2Mbps/5.8 Mbps and includes hardware and software interfaces to an application processor or a PC as wireless modem.

The company said samples and evaluation boards will be available by end of June, with volume production beginning in the second half of 2009.


Filed Under: Devices

 

Next Article

← Previous Article
Next Article →

Related Articles Read More >

High-directivity couplers optimized for 225 – 750 MHz applications
Integrated into IoT devices, iSIM poised to make inroads
Triple-radio and multiprotocol MCUs add application processors
5G vectors
How RedCap fits into 5G and IoT

Featured Contributions

  • Overcome Open RAN test and certification challenges
  • Wireless engineers need AI to build networks
  • Why AI chips need PCIe 7.0 IP interconnects
  • circuit board timing How timing and synchronization improve 5G spectrum efficiency
  • Wi-Fi 7 and 5G for FWA need testing
More Featured Contributions

EE TECH TOOLBOX

“ee
Tech Toolbox: 5G Technology
This Tech Toolbox covers the basics of 5G technology plus a story about how engineers designed and built a prototype DSL router mostly from old cellphone parts. Download this first 5G/wired/wireless communications Tech Toolbox to learn more!

EE LEARNING CENTER

EE Learning Center
“5g
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.

Engineering Training Days

engineering
“bills
5G Technology World
  • Enews Signup
  • EE World Online
  • DesignFast
  • EDABoard Forums
  • Electro-Tech-Online Forums
  • Microcontroller Tips
  • Analogic Tips
  • Connector Tips
  • Engineer’s Garage
  • EV Engineering
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips
  • About Us
  • Contact Us
  • Advertise

Copyright © 2025 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy

Search 5G Technology World