SemiGen, Inc. is pleased to announce that after moving into their new state-of-the art facility, increasing their assembly, foundry and screening capabilities, they’ve made an additional capital investment of over a half million dollars in new manufacturing and fabrication equipment to support customer demand.
The new equipment consists of improvements across their entire production platform which include: a new Mycronic MY300 pick and place system; two new Westbond Wire bonders, a new Centrotherm eutectic vacuum chamber, new HTOL / HTRB ovens, as well as a new Disco DAD3220 dicing saw. In addition, they’ve made several upgrades in their Radio Frequency (RF) test department which includes several new pieces of test and metrology tools.
“I’m excited to be in a position to continue to invest in and grow this important business to the RF/microwave industry,” said Tim Filteau, President of SemiGen. “Our CEO, Jim Morgan, has said we must do everything we can to help our customers augment their design, assembly, and hi-rel testing and up screening capabilities, and it feels great to see this new equipment getting up and running to do just that.”
SemiGen is a leading RF/microwave solutions company that provides manufacturing services and products to fill the voids in the supply chain and manufacturing floor. SemiGen’s design and manufacturing center includes RF/microwave assembly, PCB, box build, module repair and test services coupled with the semiconductor devices and manufacturing supplies needed for successful manufacturing of RF/Microwave hybrids and components. Their team helps with designs, builds prototypes, and handles volume production runs for the RF/microwave, military, space, homeland security, optical, medical device, and commercial wireless markets. Their 37,000 square foot facility includes a class 10,000 clean room and offers manual to full automatic assembly solutions.
SemiGen also offers wafer processing of silicon wafers, as well as processing ceramic substrates. Services provided include any combination of photolithography, wet etch, dry etch, metallization, grinding, polishing, as well as in-process metrology.
Their recent investments in RF test and environmental test capabilities has also enabled them to offer high-reliability (Hi-rel) screening of amplifiers, FETs, MMICs, transistors, diodes, and other RF and microwave components.
Tests can be performed and delivered with full documentation in adherence with MIL-PRF-19500, MIL-PRF-38534, and MIL-PRF-38535 requirements. Element evaluation and screening options from Class H, Class K, TX, TXV, S-level, as well as custom SCD driven requirements are available.
