5G Technology World

  • 5G Technology and Engineering
  • FAQs
  • Apps
  • Devices
  • IoT
  • RF
  • Radar
  • Wireless Design
  • Learn
    • 5G Videos
    • Ebooks
    • EE Training Days
    • FAQs
    • Learning Center
    • Tech Toolboxes
    • Webinars/Digital Events
  • Handbooks
    • 2024
    • 2023
    • 2022
    • 2021
  • Resources
    • Design Guide Library
    • EE World Digital Issues
    • Engineering Diversity & Inclusion
    • Engineering Training Days
    • LEAP Awards
  • Advertise
  • Subscribe

Qualcomm, Intel Launch Dual-Core Chipsets

By Staff Author | June 1, 2010

Qualcomm and Intel have launched high-powered, dual-core chipsets for smartphones, netbooks and smartbooks.

Qualcomm’s new dual-CPU Snapdragon chipset reaches speeds up to 1.2 GHz and marks the third generation of the Snapdragon platform. Qualcomm’s1 GHz Snapdragon chip is embedded in several high-end smartphones, including Sprint’s 4G HTC Evo device.

The new 1.2 GHz chip is available for HSPA+ and multi-mode HSPA+/CDMA2000 1xEV-DO Rev. B.

Qualcomm says chips based on its Snapdragon platform are embedded in more than 140 devices that have either launched or are currently in design.

Intel’s mobile dual-core Atom processors are currently available for netbooks and will soon launch for entry-level desktop computers. Beginning in early 2011, Intel will launch its “Oak Trail” platform for tablets and netbooks. The company claims Oak Trail reduces power consumption up to 50 percent while delivering HD-video playback and support for multiple operating systems including MeeGo, Windows 7 and Android.


Filed Under: Devices

 

Next Article

← Previous Article
Next Article →

Related Articles Read More >

High-directivity couplers optimized for 225 – 750 MHz applications
Integrated into IoT devices, iSIM poised to make inroads
Triple-radio and multiprotocol MCUs add application processors
5G vectors
How RedCap fits into 5G and IoT

Featured Contributions

  • Overcome Open RAN test and certification challenges
  • Wireless engineers need AI to build networks
  • Why AI chips need PCIe 7.0 IP interconnects
  • circuit board timing How timing and synchronization improve 5G spectrum efficiency
  • Wi-Fi 7 and 5G for FWA need testing
More Featured Contributions

EE TECH TOOLBOX

“ee
Tech Toolbox: Internet of Things
Explore practical strategies for minimizing attack surfaces, managing memory efficiently, and securing firmware. Download now to ensure your IoT implementations remain secure, efficient, and future-ready.

EE LEARNING CENTER

EE Learning Center
“5g
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.

Engineering Training Days

engineering
“bills
5G Technology World
  • Enews Signup
  • EE World Online
  • DesignFast
  • EDABoard Forums
  • Electro-Tech-Online Forums
  • Microcontroller Tips
  • Analogic Tips
  • Connector Tips
  • Engineer’s Garage
  • EV Engineering
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips
  • About Us
  • Contact Us
  • Advertise

Copyright © 2025 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy

Search 5G Technology World