5G Technology World

  • 5G Technology and Engineering
  • FAQs
  • Apps
  • Devices
  • IoT
  • RF
  • Radar
  • Wireless Design
  • Learn
    • 5G Videos
    • Ebooks
    • EE Training Days
    • FAQs
    • Learning Center
    • Tech Toolboxes
    • Webinars/Digital Events
  • Handbooks
    • 2024
    • 2023
    • 2022
    • 2021
  • Resources
    • Design Guide Library
    • EE World Digital Issues
    • Engineering Diversity & Inclusion
    • Engineering Training Days
    • LEAP Awards
  • Advertise
  • Subscribe

Report: Samsung Dropping Qualcomm Chips from Next Galaxy S

By Staff Author | January 21, 2015

Samsung will not be building the next iteration of Qualcomm’s Snapdragon chipset into its next Galaxy S smartphone, according to Bloomberg. 

Instead the Korean OEM will build its own processor into the device.

The report cites unnamed sources who say that Qualcomm’s new Snapdragon 810 chip overheated during Samsung’s tests. Both Samsung and Qualcomm declined to comment in Bloomberg’s report.

As the report points out, Samsung is sinking $15 billion into a new factory in Seoul as part of its plan to be more self-reliant in the chipset department.

That push toward using its own processors coincides with the company’s move to integrate its homegrown Tizen operating system into its connected devices.

Tizen is finding its way into Samsung’s smart TVs and has a strong foothold in the company’s wearables, but the OS has had a tougher time working into the company’s smartphones and tablets. But last week Samsung unveiled its first Tizen phone, a low-cost device aimed at India’s emerging smartphone market.

Samsung has announced plans to push harder into the Internet of Things market but its flagship phones are still a huge part of the company’s business, even as smartphone sales flatten out for the company. Samsung earlier this month forecast its first drop in profit since 2011, with shrinking smartphone growth largely to blame.


Filed Under: Devices

 

Next Article

← Previous Article
Next Article →

Related Articles Read More >

High-directivity couplers optimized for 225 – 750 MHz applications
Integrated into IoT devices, iSIM poised to make inroads
Triple-radio and multiprotocol MCUs add application processors
5G vectors
How RedCap fits into 5G and IoT

Featured Contributions

  • Overcome Open RAN test and certification challenges
  • Wireless engineers need AI to build networks
  • Why AI chips need PCIe 7.0 IP interconnects
  • circuit board timing How timing and synchronization improve 5G spectrum efficiency
  • Wi-Fi 7 and 5G for FWA need testing
More Featured Contributions

EE TECH TOOLBOX

“ee
Tech Toolbox: Internet of Things
Explore practical strategies for minimizing attack surfaces, managing memory efficiently, and securing firmware. Download now to ensure your IoT implementations remain secure, efficient, and future-ready.

EE LEARNING CENTER

EE Learning Center
“5g
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.

Engineering Training Days

engineering
“bills
5G Technology World
  • Enews Signup
  • EE World Online
  • DesignFast
  • EDABoard Forums
  • Electro-Tech-Online Forums
  • Microcontroller Tips
  • Analogic Tips
  • Connector Tips
  • Engineer’s Garage
  • EV Engineering
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips
  • About Us
  • Contact Us
  • Advertise

Copyright © 2025 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy

Search 5G Technology World