5G Technology World

  • 5G Technology and Engineering
  • FAQs
  • Apps
  • Devices
  • IoT
  • RF
  • Radar
  • Wireless Design
  • Learn
    • 5G Videos
    • Ebooks
    • EE Training Days
    • FAQs
    • Learning Center
    • Tech Toolboxes
    • Webinars/Digital Events
  • Handbooks
    • 2024
    • 2023
    • 2022
    • 2021
  • Resources
    • Design Guide Library
    • EE World Digital Issues
    • Engineering Diversity & Inclusion
    • Engineering Training Days
    • LEAP Awards
  • Advertise
  • Subscribe

Is a Bendable Samsung Smartphone on the Way?

By Diana Goovaerts | June 7, 2016

Samsung is reportedly considering the introduction of two new bendable smartphones as soon as next year.

According to Bloomberg, the devices would feature two different types of bendable screens, including one that folds in half and a handset with a 5-inch screen that expands to an 8-inch display.

Bloomberg said the flexible screens would be made using organic light-emitting diodes (OLED), and could be released as early as February 2017 at Mobile World Congress in Barcelona, Spain. That timeline would likely give Samsung a jump on Apple, which is also expected to come out with OLED displays next year.

Samsung has previously released videos featuring foldable concept devices, but has not commercially produced such a product.

But Samsung could have some competition in the flexible phone market.

Earlier this year, Apple filed patents for “flexible electronic devices” that would enable users to bend and twist their phone to complete functions. The company also laid out the possibility of a tri-fold device that incorporates both bendable and rigid components.

Both devices, Apple said, could be folded for storage.

Like Samsung’s reported concept, Apple said its bendable displays would be made of multiple layers that may include a touch sensor and an OLED array.

Despite the patent, though, Apple’s release of such a device is far from certain. The company has announced no plans to release such a device.

Credit: USPTO/Apple Inc.


Filed Under: Devices

 

Next Article

← Previous Article
Next Article →

Related Articles Read More >

High-directivity couplers optimized for 225 – 750 MHz applications
Integrated into IoT devices, iSIM poised to make inroads
Triple-radio and multiprotocol MCUs add application processors
5G vectors
How RedCap fits into 5G and IoT

Featured Contributions

  • Overcome Open RAN test and certification challenges
  • Wireless engineers need AI to build networks
  • Why AI chips need PCIe 7.0 IP interconnects
  • circuit board timing How timing and synchronization improve 5G spectrum efficiency
  • Wi-Fi 7 and 5G for FWA need testing
More Featured Contributions

EE TECH TOOLBOX

“ee
Tech Toolbox: Internet of Things
Explore practical strategies for minimizing attack surfaces, managing memory efficiently, and securing firmware. Download now to ensure your IoT implementations remain secure, efficient, and future-ready.

EE LEARNING CENTER

EE Learning Center
“5g
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.

Engineering Training Days

engineering
“bills
5G Technology World
  • Enews Signup
  • EE World Online
  • DesignFast
  • EDABoard Forums
  • Electro-Tech-Online Forums
  • Microcontroller Tips
  • Analogic Tips
  • Connector Tips
  • Engineer’s Garage
  • EV Engineering
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips
  • About Us
  • Contact Us
  • Advertise

Copyright © 2025 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy

Search 5G Technology World