KYOCERA AVX released a new line of integrated thin film (ITF) hybrid couplers designed to facilitate the continued evolution of high-frequency wireless systems in industrial, automotive, telecommunications, and telemetry applications. Hybrid couplers are special four-port directional couplers that split input signals into two equal-amplitude 3dB outputs whose phases are shifted by 90°. Many also support performance…
Open RAN test service adds colocation capabilities
VIAVI Solutions Inc. announced that it has added colocation capability to its VIAVI Automated Lab-as-a-Service for Open RAN (VALOR) facility to address the increased demand for comprehensive testing from Open RAN customers. Based in Chandler, Arizona, VALOR is funded by the U.S. National Telecommunications and Information Administration (NTIA) Public Wireless Supply Chain Innovation Fund (PWSCIF). As an alternative to…
2.4 GHz chip antennas connect IoT devices to networks
KYOCERA AVX offers a variety of extremely compact and high-performance internal, on-board, multiprotocol, 2.4GHz antennas ideal for use in system-in-package (SiP) applications — the demand for which is surging. SiP modules feature a number of integrated circuits (ICs) with distinct functionalities in a single miniature chip carrier package and often include several silicon and passive components…
Second-generation tech extends range by 50 percent
SPARK Microsystems introduces its second-generation ultra-wideband (UWB) wireless transceiver, the SR1120. The SR1120 extends SPARK’s established performance leadership in data delivery while enabling significantly lower power consumption, latency, and better interference robustness compared to Bluetooth, Wi-Fi, and 2.4 GHz radios. SPARK UWB’s data throughput leadership versus Bluetooth has doubled from 20X to 40X higher data rates (40.96…
Sequans announces production of latest LTE module
Sequans announces that its Cassiopeia CA410 module will enter mass production in the first week of April 2025. This LTE Cat 4 module has secured certifications with Southern Linc and Anterix, and complies with CBRS requirements, underscoring its readiness for deployment across diverse utility applications. In addition to the Anterix’s 900 MHz spectrum and the CBRS…
Transceiver supports 2.4 GHz ISM and SATCOM
Semtech Corporation introduced the LR2021, the first chip in the LoRa Plus family. Incorporating a fourth-generation LoRa IP, the transceiver supports both terrestrial and SATCOM networks in the Sub-GHz, 2.4 GHz ISM bands, and licensed S-band. The transceiver is designed to be backward compatible with previous LoRa devices, ensuring seamless LoRaWAN compatibility. Additionally, it features expanded…
Vehicles get Wi-Fi 7 with ublox module
u-blox has launched its first automotive-grade Wi-Fi 7 module, enabling OEMs to enhance the user experience of in-vehicle infotainment and telematics. According to the TSR Wireless Connectivity Market Report 2024, the attach rate of Wi-Fi for in-vehicle infotainment and telematics control unit applications will increase sharply over the next five years. Wi-Fi 7 will be…
IoT wireless module receives approval from two US cellular carriers
Telit Cinterion receives approval for the ME310M1-W1 module from two major U.S. MNOs. The certifications enable IoT specialists and their customers to begin using the ME310M1-W1 immediately — not only in the United States but also worldwide — thanks to its comprehensive global band support. With the support of multiple technologies, including licensed and unlicensed…
12 nm silicon IP integrates multi-standard connectivity
Ceva, Inc. unveiled the Ceva-Waves Links200, the first turnkey multi-protocol platform IP to support next-generation Bluetooth High Data Throughput (HDT) technology, alongside IEEE 802.15.4 for Zigbee, Thread, and Matter. Integrating a new Ceva-developed radio designed for TSMC’s low-power 12nm process, the comprehensive Links200 solution provides a significant time-to-market advantage by removing technology barriers and risk…
Simulation software supports 6G, GNSS, and on-body communications
Remcom announces the integration of XFdtd 3D Electromagnetic Simulation Software with Wireless InSite 3D Wireless Propagation Software through a new Huygens surface capability. The update also includes dynamic mobility, enabling the movement of RF systems, vehicles, and people through virtual wireless scenarios. These developments enable seamless interoperability between high-resolution near-field simulations and efficient 3D ray-tracing, supporting applications such as GNSS, 6G…