SPARK Microsystems introduces its second-generation ultra-wideband (UWB) wireless transceiver, the SR1120. The SR1120 extends SPARK’s established performance leadership in data delivery while enabling significantly lower power consumption, latency, and better interference robustness compared to Bluetooth, Wi-Fi, and 2.4 GHz radios. SPARK UWB’s data throughput leadership versus Bluetooth has doubled from 20X to 40X higher data rates (40.96…
Sequans announces production of latest LTE module
Sequans announces that its Cassiopeia CA410 module will enter mass production in the first week of April 2025. This LTE Cat 4 module has secured certifications with Southern Linc and Anterix, and complies with CBRS requirements, underscoring its readiness for deployment across diverse utility applications. In addition to the Anterix’s 900 MHz spectrum and the CBRS…
Transceiver supports 2.4 GHz ISM and SATCOM
Semtech Corporation introduced the LR2021, the first chip in the LoRa Plus family. Incorporating a fourth-generation LoRa IP, the transceiver supports both terrestrial and SATCOM networks in the Sub-GHz, 2.4 GHz ISM bands, and licensed S-band. The transceiver is designed to be backward compatible with previous LoRa devices, ensuring seamless LoRaWAN compatibility. Additionally, it features expanded…
Vehicles get Wi-Fi 7 with ublox module
u-blox has launched its first automotive-grade Wi-Fi 7 module, enabling OEMs to enhance the user experience of in-vehicle infotainment and telematics. According to the TSR Wireless Connectivity Market Report 2024, the attach rate of Wi-Fi for in-vehicle infotainment and telematics control unit applications will increase sharply over the next five years. Wi-Fi 7 will be…
IoT wireless module receives approval from two US cellular carriers
Telit Cinterion receives approval for the ME310M1-W1 module from two major U.S. MNOs. The certifications enable IoT specialists and their customers to begin using the ME310M1-W1 immediately — not only in the United States but also worldwide — thanks to its comprehensive global band support. With the support of multiple technologies, including licensed and unlicensed…
12 nm silicon IP integrates multi-standard connectivity
Ceva, Inc. unveiled the Ceva-Waves Links200, the first turnkey multi-protocol platform IP to support next-generation Bluetooth High Data Throughput (HDT) technology, alongside IEEE 802.15.4 for Zigbee, Thread, and Matter. Integrating a new Ceva-developed radio designed for TSMC’s low-power 12nm process, the comprehensive Links200 solution provides a significant time-to-market advantage by removing technology barriers and risk…
Simulation software supports 6G, GNSS, and on-body communications
Remcom announces the integration of XFdtd 3D Electromagnetic Simulation Software with Wireless InSite 3D Wireless Propagation Software through a new Huygens surface capability. The update also includes dynamic mobility, enabling the movement of RF systems, vehicles, and people through virtual wireless scenarios. These developments enable seamless interoperability between high-resolution near-field simulations and efficient 3D ray-tracing, supporting applications such as GNSS, 6G…
Module connects IoT devices to Wi-Fi, Bluetooth, and 802.15.4 networks
u-blox announces the launch of the MAYA-W4, a cost-efficient tri-radio module that delivers the latest in wireless connectivity technologies for the mass market. With support for dual-band Wi-Fi 6, Bluetooth Low Energy 5.4, and 802.15.4 (for Thread supporting Matter), the MAYA-W4 is set to redefine the landscape of IoT applications in diverse industries, enhancing device…
IMS 2024 roundup: RF components
Washington, DC — The International Microwave Symposium (IMS), which took place here in June 2024, featured a wide array of RF, microwave, and mmWave components. These components range from passive connectors and waveguides to amplifiers, switches, filters, and data converters. In general, these components make their way into military communications systems or commercial wireless networks.…
Viavi, R&S combine to test OpenRAN radios
Rohde & Schwarz (R&S) and VIAVI Solutions Inc. announced an expansion of their partnership delivering state-of-the-art O-RU testing. These solutions are ideally suited to the needs of radio manufacturers planning to bid for the United States Department of Commerce’s National Telecommunications and Information Administration (NTIA) Public Wireless Supply Chain Innovation Fund (PWSCIF) Second Notice of…