4G chipmaker Sequans Communications, in collaboration with Aeroflex Incorporated, will conduct a live LTE throughput demonstration at International CTIA Wireless at Sequans’ booth, number 3110, May 8-10, at the Ernest N. Morial Convention Center in New Orleans.
Sequans is one of the very few LTE chipmakers delivering category 4 throughput today. The demonstration features a Sequans-powered USB dongle providing LTE connectivity to a PC and the Aeroflex 7100 Digital Radio Test Set, which is being used to benchmark the industry-leading CAT 4 data throughput rates of more than 125 Mbps over single carrier TD-LTE. 125 Mbps approaches the theoretical maximum for TDD throughput in a 20 MHz channel and is a significant achievement.
The LTE chip powering the USB dongle is the Sequans SQN3110, the baseband chip at the heart of Sequans’ second generation Andromeda LTE platform for mobile devices. It is built in 40 nm CMOS, is 3GPP R9 compliant, supports both TDD and FDD for global compatibility, and comes in a very small 10×10 mm package that includes SDRAM.
The Aeroflex 7100 is an ideal platform for data throughput benchmark tests, supporting both FDD and TDD LTE, and it also benefits from integral baseband fading and noise generation capability that allows the user to simulate realistic signal impairments.