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First News Briefs: Broadcom, K-Touch, Anritsu, InterDigital, Soitec, SunEdison

By Wireless Week staff | November 27, 2013

Broadcom Corporation today announced that the Chinese cellphone manufacturer K-Touch has chosen its quad-core turnkey platform for its new W98 and W96 Android-based smartphones. Powered by an HSPA+ 1.2-GHz quad-core processor, RF Transceiver, power management IC, connectivity combo chip and multi-constellation GNSS location chip, Broadcom’s integrated smartphone platform allows K-Touch to provide customers with smartphones that can operate on China Unicom’s HSPA+ network.

Anritsu Company introduced a new frequency option for its PIM Master MW82119A handheld PIM analyzer that is a field solution for verifying low PIM performance in both PCS and AWS networks.

InterDigital today announced that its patent holding subsidiaries have entered into a worldwide, non-exclusive, royalty-bearing patent license agreement with Teltronic S.A. Unipersonal for 4G technologies, including LTE. Teltronic is a communications company that provides radio and mobile broadband solutions to the public safety and law enforcement, transportation, education and manufacturing segments.

Soitec and SunEdison announced that they have entered into a patent cross-license agreement relating to silicon-on-insulator (SOI) wafer products. The agreement provides each company with access to the other’s patent portfolio for SOI technologies and ends all outstanding legal disputes between the companies.

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