SemiGen, Inc. an ISO and ITAR registered provider of RF and microwave contract assembly, foundry services, semiconductor devices, and RF supplies has announced the release of their thin film circuit design guidelines. Designed to help RF, microwave, and millimeter-wave circuit design engineers with optimizing their layouts for SemiGen’s advanced ion beam milling/etching process, the layout…
Tech Brief Helps Make Critical Thin Film Manufacturing Decision
SemiGen, Inc. has released a technical brief detailing the advantages to RF/microwave circuit designers of manufacturing their circuits using ion beam milling over chemical etching. This tech brief describes manufacturing thin film circuits using a next-generation anisotropic ion beam milling process that is proving to be the most precise, repeatable, and clean approach over the more…
Microwave Manufacturing and Test Equipment Upgrades
SemiGen, Inc. is pleased to announce that after moving into their new state-of-the art facility, increasing their assembly, foundry and screening capabilities, they’ve made an additional capital investment of over a half million dollars in new manufacturing and fabrication equipment to support customer demand. The new equipment consists of improvements across their entire production platform…
Tech Brief Describes the Best Eutectic Die-attach Method for MMICs in Hybrid Assemblies
SemiGen, Inc. has announced the publication of a new Tech Brief “Eutectic Die-Attach of GaN and GaAs MMICs.” The latest in RF/microwave GaN and GaAs MMIC circuit chips (die) are providing higher power levels than previous solid-state technologies. These new-generation devices require incredible precision and consistency throughout the die-attach and microwave assembly process to ensure…